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RELATED DEVICE CODES:

XC7K70T, XC7K160T, XC7K325T, XC7K410T, XC7K420T, XC7K480T, XC7K355T,

RELATED MODEL NUMBERS:

XC7K70T-L1FBG484C, XC7K70T-L1FBG484E, XC7K70T-L1FBG484I, XC7K70T-L1FBV484C, XC7K70T-L1FBV484E, XC7K70T-L1FBV484I, XC7K70T-L1FBG676C, XC7K70T-L1FBG676E, XC7K70T-L1FBG676I, XC7K70T-L1FBV676C, XC7K70T-L1FBV676E, XC7K70T-L1FBV676I, XC7K70T-L2FBG484C, XC7K70T-L2FBG484E, XC7K70T-L2FBG484I, XC7K70T-L2FBV484C, XC7K70T-L2FBV484E, XC7K70T-L2FBV484I, XC7K70T-L2FBG676C, XC7K70T-L2FBG676E, XC7K70T-L2FBG676I, XC7K70T-L2FBV676C, XC7K70T-L2FBV676E, XC7K70T-L2FBV676I, XC7K70T-G2FBG484C, XC7K70T-G2FBG484E, XC7K70T-G2FBG484I, XC7K70T-G2FBV484C, XC7K70T-G2FBV484E, XC7K70T-G2FBV484I, XC7K70T-G2FBG676C, XC7K70T-G2FBG676E, XC7K70T-G2FBG676I, XC7K70T-G2FBV676C, XC7K70T-G2FBV676E, XC7K70T-G2FBV676I, XC7K70T-1FBG484C, XC7K70T-1FBG484E, XC7K70T-1FBG484I, XC7K70T-1FBV484C, XC7K70T-1FBV484E, XC7K70T-1FBV484I, XC7K70T-1FBG676C, XC7K70T-1FBG676E, XC7K70T-1FBG676I, XC7K70T-1FBV676C, XC7K70T-1FBV676E, XC7K70T-1FBV676I, XC7K70T-2FBG484C, XC7K70T-2FBG484E, XC7K70T-2FBG484I, XC7K70T-2FBV484C, XC7K70T-2FBV484E, XC7K70T-2FBV484I, XC7K70T-2FBG676C, XC7K70T-2FBG676E, XC7K70T-2FBG676I, XC7K70T-3FBV676C, XC7K70T-3FBV676E, XC7K70T-3FBV676I

Xilinx XC7K70T

Product Overview
Manufacturer Xilinx
Category FPGA

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Description

Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:

  • Artix®-7 Family: Optimized for lowest cost and power with small form-factor packaging for the highest volume applications.
  • Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.
  • Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

Features:

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
  • High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
  • Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.