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RELATED DEVICE CODES:

XC3S100E, XC3S250E, XC3S500E, XC3S1200E, XC3S1600E,

RELATED MODEL NUMBERS:

XC3S100E-4VQ100C, XC3S100E-4VQ100I, XC3S100E-4VQG100C, XC3S100E-4VQG100I, XC3S100E-4CP132C, XC3S100E-4CP132I, XC3S100E-4CPG132C, XC3S100E-4CPG132I, XC3S100E-4TQ144C, XC3S100E-4TQ144I, XC3S100E-4TQG144C, XC3S100E-4TQG144I, XC3S100E-5VQ100C, XC3S100E-5VQ100I, XC3S100E-5VQG100C, XC3S100E-5VQG100I, XC3S100E-5CP132C, XC3S100E-5CP132I, XC3S100E-5CPG132C, XC3S100E-5CPG132I, XC3S100E-5TQ144C, XC3S100E-5TQ144I, XC3S100E-5TQG144C, XC3S100E-5TQG144I,

Xilinx XC3S100E

Product Overview
Manufacturer Xilinx
Category FPGA

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Description

The Spartan®-3E family of Field-Programmable Gate Arrays (FPGAs) is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The five-member family offers densities ranging from 100,000 to 1.6 million system gates, as shown in Table 1.

The Spartan-3E family builds on the success of the earlier Spartan-3 family by increasing the amount of logic per I/O, significantly reducing the cost per logic cell. New features improve system performance and reduce the cost of configuration. These Spartan-3E FPGA enhancements, combined with advanced 90 nm process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.

Because of their exceptionally low cost, Spartan-3E FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection, and digital television equipment.

The Spartan-3E family is a superior alternative to mask programmed ASICs. FPGAs avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.

Table 1: Summary of Spartan-3E FPGA Attributes

DeviceSystem GatesEquivalent Logic CellsCLB Array (One CLB = Four Slices)Distributed RAM bits(1)Block RAM bits(1)Dedicated MultipliersDCMsMaximum User I/O

Maximum Differential

I/O Pairs

RowsColumnsTotal CLBsTotal Slices
XC3S100E100K2,160221624096015K72K4210840
XC3S250E250K5,50834266122,44838K216K12417268
XC3S500E500K10,47646341,1644,65673K360K20423292
XC3S1200E1200K19,51260462,1688,672136K504K288304124
XC3S1600E1600K33,19276583,68814,752231K648K368376156

Features:

  • Very low cost, high-performance logic solution for high-volume, consumer-oriented applications
  • Proven advanced 90-nanometer process technology
  • Multi-voltage, multi-standard SelectIO™ interface pins
    • Up to 376 I/O pins or 156 differential signal pairs
    • LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
    • 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
    • 622+ Mb/s data transfer rate per I/O
    • True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O
    • Enhanced Double Data Rate (DDR) support
    • DDR SDRAM support up to 333 Mb/s
  • Abundant, flexible logic resources
    • Densities up to 33,192 logic cells, including optional shift register or distributed RAM support
    • Efficient wide multiplexers, wide logic
    • Fast look-ahead carry logic
    • Enhanced 18 x 18 multipliers with optional pipeline
    • IEEE 1149.1/1532 JTAG programming/debug port
  • Hierarchical SelectRAM™ memory architecture
    • Up to 648 Kbits of fast block RAM
    • Up to 231 Kbits of efficient distributed RAM
  • Up to eight Digital Clock Managers (DCMs)
    • Clock skew elimination (delay locked loop)
    • Frequency synthesis, multiplication, division
    • High-resolution phase shifting
    • Wide frequency range (5 MHz to over 300 MHz)
  • Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing
  • Configuration interface to industry-standard PROMs
    • Low-cost, space-saving SPI serial Flash PROM
    • X8 or x8/x16 parallel NOR Flash PROM
    • Low-cost Xilinx® Platform Flash with JTAG
  • Complete Xilinx ISE® and WebPACK™ software
  • MicroBlaze™ and PicoBlaze? embedded processor cores
  • Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices)
  • Low-cost QFP and BGA packaging options
  • Common footprints support easy density migration
  • Pb-free packaging options
  • XA Automotive version available