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RELATED DEVICE CODES:

XC4013E,

RELATED MODEL NUMBERS:

"XC4013E-6PC240, XC4013E-6PQ240, XC4013E-6VQ240, XC4013E-6TQ240, XC4013E-6BG240, XC4013E-6PG240, XC4013E-6HQ240, XC4013E-6MQ240, XC4013E-6CB240, XC4013E-5PC240, XC4013E-5PQ240, XC4013E-5VQ240, XC4013E-5TQ240, XC4013E-5BG240, XC4013E-5PG240, XC4013E-5HQ240, XC4013E-5MQ240, XC4013E-5CB240, XC4013E-4PC240, XC4013E-1CB240, XC4013E-6PC240C, XC4013E-6PC240I, XC4013E-6PC240M, XC4013E-6PQ240C, XC4013E-6PQ240I, XC4013E-6PQ240M, XC4013E-6VQ240C, XC4013E-6VQ240I, XC4013E-6VQ240M, XC4013E-6TQ240C, XC4013E-6TQ240I, XC4013E-6TQ240M, XC4013E-6BG240C, XC4013E-6BG240I, XC4013E-6BG240M, XC4013E-6PG240C, XC4013E-6PG240I, XC4013E-6PG240M, XC4013E-6HQ240C, XC4013E-6HQ240I, XC4013E-6HQ240M, XC4013E-6MQ240C, XC4013E-6MQ240I, XC4013E-6MQ240M, XC4013E-6CB240C, XC4013E-6CB240I, XC4013E-6CB240M, XC4013E-5PC240C, XC4013E-5PC240I, XC4013E-5PC240M, XC4013E-5PQ240C, XC4013E-5PQ240I, XC4013E-5PQ240M, XC4013E-5VQ240C, XC4013E-5VQ240I, XC4013E-5VQ240M, XC4013E-5TQ240C, XC4013E-5TQ240I, XC4013E-5TQ240M, XC4013E-5BG240C, XC4013E-5BG240I, XC4013E-5BG240M, XC4013E-5PG240C, XC4013E-5PG240I, XC4013E-5PG240M, XC4013E-5HQ240C, XC4013E-5HQ240I, XC4013E-5HQ240M, XC4013E-5MQ240C, XC4013E-5MQ240I, XC4013E-5MQ240M, XC4013E-5CB240C, XC4013E-5CB240I, XC4013E-5CB240M, XC4013E-4PC240C, XC4013E-4PC240I, XC4013E-4PC240M, XC4013E-1CB240C, XC4013E-1CB240I, XC4013E-1CB240M, "

Xilinx XC4013E

Product Overview
Manufacturer Xilinx
Category FPGA

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Description

Definition of Terms

In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as follows:

Advance:?Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or device families. Values are subject to change. Use as estimates, not for production.

Preliminary:?Based on preliminary characterization. Further changes are not expected.

Unmarked:?Specifications not identified as either Advance or Preliminary are to be considered Final.

Except for pin-to-pin input and output parameters, the a.c. parameter delay specifications included in this document are derived from measuring internal test patterns. All specifications are representative of worst-case supply voltage and junction temperature conditions.

All specifications subject to change without notice.

Features:

Absolute Maximum Ratings

 Description Units
VCCSupply voltage relative to Ground-0.5 to 4.0V
VINInput voltage relative to Ground (Note 1)-0.5 to 5.5V
VTSVoltage applied to 3-state output (Note 1)-0.5 to 5.5V
VCCtLongest Supply Voltage Rise Time from 1 V to 3V50ms
TSTGStorage temperature (ambient)-65 to +150°C
TSOLMaximum soldering temperature (10 s @ 1/16 in. = 1.5 mm)+260°C
TJJunction TemperatureCeramic packages+150°C
Plastic packages+125°C

Note 1: Maximum DC excursion above Vcc or below Ground must be limited to either 0.5 V or 10 mA, whichever is easier to achieve. During transitions, the device pins may undershoot to -2.0 V or overshoot toVCC +2.0 V, provided this over or undershoot lasts less than 10 ns and with the forcing current being limited to 200 mA.

Note: Stresses beyond thouse listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond thouse listed under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability

Recommended Operating Conditions

SymbolDescriptionMinMaxUnits
VCCSupply voltage relative to Gnd, TJ = 0 °C to +85°CCommercial3.03.6V
Supply voltage relative to Gnd, TJ = -40°C to +100°CIndustrial3.03.6V
VIHHigh-level input voltage50% of VCC5.5MaxV
VILLow-level input voltage030% of VCCV
TINInput signal transition time 250ns

Notes: At junction temperatures above thouse listed above, all delay parameters increase by 0.35% per °C. Input and output measurement threshold is ~50% of VCC.